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JIS C 62137-3:2014

Current

Current

The latest, up-to-date edition.

Electronics Assembly Technology -- Part 3: Selection guidance of environmental and endurance test methods for solder joints

Published date

22-09-2014

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DocumentType
Standard
PublisherName
Japanese Standards Association
Status
Current

Standards Relationship
IEC 62137-3:2011 Identical

2014 [22/09/2014]

Sorry this product is not available in your region.