JIS C 62137-4:2016
Current
Current
The latest, up-to-date edition.
Electronics assembly technology -- Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Published date
22-03-2016
Publisher
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| DocumentType |
Standard
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62137-4:2014 | Identical |
2016 [22/03/2016]
Sorry this product is not available in your region.