JIS C 6472:1995
Current
The latest, up-to-date edition.
Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
Hardcopy , PDF
English, Japanese
30-04-1995
Important note : Users cannot be edited or removed once added to your Multi user PDF.
This Japanese Industrial Standard specifies the copper-clad laminates to be used for flexible printed wiring boards (employing, polyester film or polyimide film as the base) (hereafter referred to as "copper-clad laminates").
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2014 1995(R2014) [20/10/2014]1995(R2009) [01/10/2009]1995(R2000) [20/03/2000]1995 [01/03/1995]1990
| JIS C 6471:1995 | Test methods of copper-clad laminates for flexible printed wiring boards |
| JIS C 6512:1992 | Electrodeposited Copper Foil For Printed Wiring Boards |
| JIS C 6480:1994 | General rules of copper-clad laminates for printed wiring boards |
| JIS E 5006:2005 | Electronic Equipment For Rolling Stock |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.