JIS C 6485:2008
Current
The latest, up-to-date edition.
Base materials for printed circuits -- Paper base, phenolic resin
English
20-08-2008
This Japanese Industrial Standard specifies the requirements for properties of paper based phenolic resin copper-clad laminates of both economic and high electrical grades, in thicknesses of 0.8 mm up to 3.2 mm.
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
Reaffirmed 2017
| JIS C 6481:1996 | Test methods of copper-clad laminates for printed wiring boards |
| JIS C 6515:1998 | Copper foil for printed wiring boards |
| JIS Z 3851:1992 | Standard qualification procedure for micro soldering technique |
| JIS C 5013:1996 | Single and double sided printed wiring boards |
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