JIS C 6493:1999
Current
The latest, up-to-date edition.
Base materials for printed circuits - Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
Hardcopy , PDF
English, Japanese
29-02-2000
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The specification gives requirements for properties of thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical fire resistance) for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm. Although primarily intended for multilayer boards, the materials may be used for single-sided or double-sided printed boards. Polyimide woven glass fabric laminates are available in two types: -- type 1: modified polyimide resin; -- type 2: unmodified polyimide resin. The two types have equal properties except for the glass transition temperature, and therefore this specification differentiates them only in respect of the glass transition temperature.
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2014 1999(R2014) [20/10/2014]1999(R2009) [01/10/2009]1999 [20/11/1999]1994 [01/08/1994]
| JIS C 6481:1996 | Test methods of copper-clad laminates for printed wiring boards |
| JIS C 6515:1998 | Copper foil for printed wiring boards |
| JIS C 6523:1995 | Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth |
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