JIS C 6494:1999
Current
The latest, up-to-date edition.
Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Hardcopy , PDF
English, Japanese
29-02-2000
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This specification gives requirements for properties of thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical fire resistance) for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm. Although primarily intended for multilayer boards, the materials may be used for single-sided or double-sided printed boards.
| DocumentType |
Standard
|
| Pages |
10
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2014 1999(R2014) [20/10/2014]1999(R2009) [01/10/2009]1999 [20/11/1999]1994 [01/08/1994]
| JIS C 6481:1996 | Test methods of copper-clad laminates for printed wiring boards |
| JIS C 6515:1998 | Copper foil for printed wiring boards |
| JIS C 6524:1995 | Prepreg for multilayer printed wiring boards - Bismaleimide/Triazine/Epoxide resin-impregnated glass cloth |
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