JIS C 6515:1998
Current
The latest, up-to-date edition.
Copper foil for printed wiring boards
Hardcopy , PDF
English, Japanese
30-11-1998
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This specification gives requirements for properties of copper toil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61249-5-1:1995 | Identical |
Reaffirmed 2014 1998(R2014) [20/10/2014]1998(R2009) [01/10/2009]1998 [20/10/1998]
| JIS C 6489:1999 | Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test) |
| JIS C 6488:1999 | Base materials for printed circuits - Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test) |
| JIS C 6493:1999 | Base materials for printed circuits - Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board |
| JIS C 6494:1999 | Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards |
| JIS C 6485:2008 | Base materials for printed circuits - Paper base, phenolic resin |
| JIS C 6484:2005 | Base materials for printed circuits - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test) |
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