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JIS H 8646:1991

Current

Current

The latest, up-to-date edition.

Electroless copper platings

Available format(s)

PDF

Language(s)

English

Published date

31-03-1991

€32.70
Excluding VAT

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This Japanese Industrial Standard specifies the electroless copper plating (hereafter referred to as the \"plating\") 5 mum or thicker used for printed wiring boards by additive process.

DocumentType
Standard
Pages
12
ProductNote
Japanese PDF version unavailable from Intertek Inform.
PublisherName
Japanese Standards Association
Status
Current

Reaffirmed 2015 91(R2015) [20/10/2015]91(R2010) [01/10/2010]91(R2000) [20/09/2000]91 [01/06/1991]

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JIS P 8115:2001 Paper and board -- Determination of folding endurance -- MIT method
JIS C 5012:1993 Test methods for printed wiring boards
JIS C 6480:1994 General rules of copper-clad laminates for printed wiring boards

€32.70
Excluding VAT