JIS Z 3198-1:2014
Current
The latest, up-to-date edition.
Test methods for lead-free solders -- Part 1: Methods for measuring of melting temperature ranges
English
20-06-2014
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Summary of test
5 Test equipment and apparatus
6 Calibration of the temperature
7 Procedure for the measuring method
8 Test report
Annex A (normative) - Test report on melting
temperatures of solder alloys
Annex JA (informative) - Comparison table between
JIS and corresponding International Standard
This Japanese Industrial Standard specifies the methods for measuring of melting temperature ranges of lead-free solders that are mainly used for wiring of electric, electrical and communication equipment, and for other apparatus, as well as connecting components.
| DocumentType |
Standard
|
| Pages |
11
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
2014 [20/06/2014]2003(R2008) [01/10/2008]2003 [20/06/2003]
| JIS C 1602:2015 | Thermocouples |
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