JIS Z 3198-3:2003
Current
The latest, up-to-date edition.
Test methods for lead-free solders -- Part 3: Methods for spread test Part 3: Methods for spread test
English
20-06-2003
This Standard specifies the method of spread test of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
| DocumentType |
Standard
|
| Pages |
4
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2013 2003(R2013) [21/10/2013]2003(R2008) [01/10/2008]2003 [20/06/2003]
| JIS Z 3284:1994 | Solder paste |
| JIS H 3100:2006 | Copper and copper alloy sheets, plates and strips |
| JIS K 8034:2006 | Acetone |
| JIS K 8839:2007 | 2-Propanol (Reagent) |
| JIS K 5902:1969 | Colophonium |
| JIS B 7502:1994 | Micrometer callipers |
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