JIS Z 3198-6:2003
Current
The latest, up-to-date edition.
Test methods for lead-free solders -- Part 6: Methods for 45°pull test of solder joints on QFP lead Part 6: Methods for 45°pull test of solder joints on QFP lead
English
20-06-2003
This Standard specifies methods for 45 deg. pull test of solder joints on QFP lead to be used principally for wiring connection, components connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
| DocumentType |
Standard
|
| Pages |
3
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2013 2003(R2013) [21/10/2013]2003(R2008) [01/10/2008]2003 [20/06/2003]
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS Z 3284:1994 | Solder paste |
| JIS Z 3283:2006 | Resin flux cored solders |
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