JIS Z 3198-7:2003
Current
The latest, up-to-date edition.
Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components
English
20-06-2003
This Standard specifies test methods for shear strength of solder joints on chip components by using lead-free solder to be used principally for wiring connection of electrical machining and apparatus, electronic apparatus, communication equipment or the like, wiring connection of components and the like.
| DocumentType |
Standard
|
| Pages |
3
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2013 2003(R2013) [21/10/2013]2003(R2008) [01/10/2008]2003 [20/06/2003]
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS Z 3284:1994 | Solder paste |
| JIS Z 3283:2006 | Resin flux cored solders |
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