JIS Z 3282:2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Soft solders - Chemical compositions and forms
Hardcopy , PDF
22-09-2017
Japanese, English
25-03-2006
Important note : Users cannot be edited or removed once added to your Multi user PDF.
This Standard specifies lead-containing soft solders used in the field of general or electric/electronic industries and soft solders not containing lead.
| DocumentType |
Standard
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| Pages |
0
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| PublisherName |
Japanese Standards Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
Reaffirmed 2015
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| JIS Z 3910:1990 | Methods for chemical analysis of solder |
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| JIS Z 3197:1999 | Testing methods for soldering fluxes |
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| JIS H 8645:1999 | Autocatalytic nickel-phosphorus coatings on metals |
| JIS Z 3198-5:2003 | Test methods for lead-free solders Part 5: Methods for tensile tests and shear tests on solder joints |
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| JIS Z 3198-4:2003 | Test methods for lead-free solders Part 4: Methods for solderbility test by a wetting balance method and a contact angle method |
| JIS H 8621:1998 | Electroplated coatings of silver for engineering purposes |
| JIS F 7603:1992 | Small Ships - Tools And Instruments Of Engine Department |
| JIS Z 3910:1990 | Methods for chemical analysis of solder |
| JIS C 60068-2-21:2002 | Environmental testing Part 2-21: Tests - Test U: Robustness of termination and integral mounting devices |
| JIS C 5441:1994 | Testing methods of switches for use in electronic equipment |
| JIS C 5202:1990 | Test methods of fixed resistors for electronic equipment |
| JIS H 8620:1998 | Electroplated coatings of gold and gold alloy for engineering purposes |
| JIS Z 3851:1992 | Standard qualification procedure for micro soldering technique |
| JIS K 2408:1996 | Corrosion Inhibitors For Engine Coolant |
| JIS C 6471:1995 | Test methods of copper-clad laminates for flexible printed wiring boards |
| JIS Z 3283:2006 | Resin flux cored solders |
| JIS C 6481:1996 | Test methods of copper-clad laminates for printed wiring boards |
| JIS H 8619:1999 | Electroplated coatings of tin |
| JIS Z 3284:1994 | Solder paste |
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| JIS E 4118:2004 | Bourdon Tube Pressure Gauges For Railway Rolling Stock |
| JIS Z 3910:2008 | Methods for chemical analysis of solder |
| JIS C 62024-1:2006 | High Frequency Inductive Components - Electrical Characteristics And Measuring Methods - Part 1: Nanohenry Range Chip Inductor |
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