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JIS Z 3282:2006

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Soft solders -- Chemical compositions and forms

Available format(s)

PDF

Language(s)

English

Published date

25-03-2006

Superseded date

22-09-2017

Superseded by

JIS Z 3282:2017

€34.68
Excluding VAT

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This Standard specifies lead-containing soft solders used in the field of general or electric/electronic industries and soft solders not containing lead.

DocumentType
Standard
Pages
15
ProductNote
Japanese PDF version unavailable from Intertek Inform.
PublisherName
Japanese Standards Association
Status
Superseded
SupersededBy
Supersedes

Reaffirmed 2015

JIS Z 3198-1:2003 Test methods for lead-free solders -- Part 1: Methods for measuring of melting temperature ranges Part 1: Methods for measuring of melting temperature ranges
JIS H 0321:1973 General rules for inspection of non-ferrous metal materials
JIS Z 3910:2008 Methods for chemical analysis of solder
JIS Z 3910:1990 Methods for chemical analysis of solder
JIS Z 3284:1994 Solder paste

JIS C 5321:1997 Methods of test for high frequency inductors and intermediate frequency transformers for electronic equipment
JIS Z 3197:1999 Testing methods for soldering fluxes
JIS H 8624:1999 Electroplated coatings of Tin-lead alloys
JIS C 5402:1992 Method for test of connectors for use in electronic equipment
JIS H 8645:1999 Autocatalytic nickel-phosphorus coatings on metals
JIS Z 3198-5:2003 Test methods for lead-free solders -- Part 5: Methods for tensile tests and shear tests on solder joints Part 5: Methods for tensile tests and shear tests on solder joints
JIS L 6405:1978 Wire healds for frame weaving of looms
JIS Z 1602:2003 18 liter metal cans
JIS C 5012:1993 Test methods for printed wiring boards
JIS H 8504:1999 Methods of adhesion test for metallic coatings
JIS C 6462:1996 Test methods of variable capacitors for use in electronic equipment
JIS C 3003:1999 Methods of test for enamelled wires
JIS A 4413:1991 Piping units for dwellings
JIS C 5444:2000 Testing methods of surface mounting switches for use in electronic equipment
JIS Z 3198-4:2003 Test methods for lead-free solders -- Part 4: Methods for solderbility test by a wetting balance method and a contact angle method Part 4: Methods for solderbility test by a wetting balance method and a contact angle method
JIS H 8621:1998 Electroplated coatings of silver for engineering purposes
JIS F 7603:1992 Small ships -- Tools and instruments of engine department
JIS Z 3910:1990 Methods for chemical analysis of solder
JIS C 60068-2-21:2002 Environmental testing -- Part 2-21: Tests -- Test U: Robustness of termination and integral mounting devices Part 2-21: Tests - Test U: Robustness of termination and integral mounting devices
JIS C 5441:1994 Testing methods of switches for use in electronic equipment
JIS C 5202:1990 Test methods of fixed resistors for electronic equipment
JIS H 8620:1998 Electroplated coatings of gold and gold alloy for engineering purposes
JIS Z 3851:1992 Standard qualification procedure for micro soldering technique
JIS K 2408:1996 Corrosion inhibitors for engine coolant
JIS C 6471:1995 Test methods of copper-clad laminates for flexible printed wiring boards
JIS Z 3283:2006 Resin flux cored solders
JIS C 6481:1996 Test methods of copper-clad laminates for printed wiring boards
JIS H 8619:1999 Electroplated coatings of tin
JIS Z 3284:1994 Solder paste
JIS C 61191-1:2006 Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
JIS E 4118:2004 Bourdon tube pressure gauges for railway rolling stock
JIS Z 3910:2008 Methods for chemical analysis of solder
JIS C 62024-1:2006 High frequency inductive components -- Electrical characteristics and measuring methods -- Part 1: Nanohenry range chip inductor

€34.68
Excluding VAT