JIS Z 3284-2:2014
Current
The latest, up-to-date edition.
Solder Paste - Part 2: Test Methods For Solder Particle Shape, Surface Condition Judgment, And Particle Size Distribution
Hardcopy , PDF
English, Japanese
20-06-2014
Important note : Users cannot be edited or removed once added to your Multi user PDF.Introduction1 Scope2 Normative references3 Terms and definitions4 Test methodsAnnex A (normative) - Characteristics evaluation table of solder pasteAnnex JA (informative) - Comparison table between JIS and corresponding International Standard
Describes the shape, surface condition judgment test and particle size distribution measurement test of the solder particles of solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
| DocumentType |
Test Method
|
| Pages |
17
|
| ProductNote |
Supersedes JIS Z3284. (06/2014)
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
2014 [20/06/2014]
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