JIS Z 3284-3:2014
Current
The latest, up-to-date edition.
Solder Paste - Part 3: Test Methods For Printability, Viscosity, Slump And Tackiness
Hardcopy , PDF
English, Japanese
20-06-2014
Important note : Users cannot be edited or removed once added to your Multi user PDF.Introduction1 Scope2 Normative references3 Terms and definitions4 Test methodsAnnex JA (normative) - Characteristics evaluation table of solder pasteAnnex JB (informative) - Comparison table between JIS and corresponding International Standard
This Standard specifies the printability test, viscosity test, slump-in-printing test, slump-in-heating test and tackiness test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
| DocumentType |
Test Method
|
| Pages |
23
|
| ProductNote |
Supersedes JIS Z3284. (06/2014)
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
2014 [20/06/2014]
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