Solder Paste - Part 3: Test Methods For Printability, Viscosity, Slump And Tackiness

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

20-06-2014

Publisher

Japanese Standards Association

Introduction1 Scope2 Normative references3 Terms and definitions4 Test methodsAnnex JA (normative) - Characteristics evaluation table of solder pasteAnnex JB (informative) - Comparison table between JIS and corresponding International Standard

This Standard specifies the printability test, viscosity test, slump-in-printing test, slump-in-heating test and tackiness test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.

DocumentType	Test Method
Pages	23
ProductNote	Supersedes JIS Z3284. (06/2014)
PublisherName	Japanese Standards Association
Status	Current
Supersedes	JIS Z 3284:1994

2014 [20/06/2014]

View more information

€45.81

Excluding VAT

Product format

I agree to the DRM document license rules apply against the PDF selection made.

Please confirm that you agree to the document license rules for this document.

I agree to the document license rules .

Please confirm that you agree to the document license rules for this document.

Access your standards online with a subscription

Features

Simple online access to standards, technical information and regulations.
Critical updates of standards and customisable alerts and notifications.
Multi-user online standards collection: secure, flexible and cost effective.

Get in touch with us

JIS Z 3284-3:2014

Solder Paste - Part 3: Test Methods For Printability, Viscosity, Slump And Tackiness

Table of Contents

Abstract

General Product Information

History

Category

Subcategory