JIS Z 3284-4:2014
Current
The latest, up-to-date edition.
Solder Paste - Part 4: Test Methods For Wettability, Solderball And Spread
Hardcopy , PDF
English, Japanese
20-06-2014
Important note : Users cannot be edited or removed once added to your Multi user PDF.Introduction1 Scope2 Normative references3 Terms and definitions4 Test methodsAnnex A (normative) - Characteristics evaluation table of solder pasteAnnex JA (informative) - Comparison table between JIS and corresponding International Standard
Defines the flux efficacy and de-wetting test, solderball test, spread test, wetting balance test and displacement detection wetting test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
| DocumentType |
Test Method
|
| Pages |
32
|
| ProductNote |
Supersedes JIS Z3284. (06/2014)
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
2014 [20/06/2014]
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