Solder Paste - Part 4: Test Methods For Wettability, Solderball And Spread

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

20-06-2014

Publisher

Japanese Standards Association

Introduction1 Scope2 Normative references3 Terms and definitions4 Test methodsAnnex A (normative) - Characteristics evaluation table of solder pasteAnnex JA (informative) - Comparison table between JIS and corresponding International Standard

Defines the flux efficacy and de-wetting test, solderball test, spread test, wetting balance test and displacement detection wetting test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.

DocumentType	Test Method
Pages	32
ProductNote	Supersedes JIS Z3284. (06/2014)
PublisherName	Japanese Standards Association
Status	Current
Supersedes	JIS Z 3284:1994

2014 [20/06/2014]

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JIS Z 3284-4:2014

Solder Paste - Part 4: Test Methods For Wettability, Solderball And Spread

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Abstract

General Product Information

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