MIL-DTL-28754-100 Revision A:2015
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 200 CONTACT, CENTER
Available format(s)
PDF
Superseded date
15-04-2021
Language(s)
English
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
FSC 5935
|
| DevelopmentNote |
Supersedes MIL C 28754/100. (01/2016)
|
| DocumentType |
Standard
|
| Pages |
11
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| MIL C 28754 : D | CONNECTOR, ELECTRICAL, MODULAR AND COMPONENT PARTS, GENERAL SPECIFICATION FOR |
| SAE AMS4173F | Aluminum Alloy, Extrusions 1.0Mg - 0.60Si - 0.30Cu - 0.20Cr (6061-T6511 or T6510) Solution Heat Treated, Stress Relieved by Stretching, Straightened, and Precipitation Heat Treated |
| SAE AMS4150M | Aluminum Alloy, Extrusions and Rings 1.0Mg - 0.60Si - 0.28Cu - 0.20Cr - (6061-T6) Solution and Precipitation Heat Treated |
| MIL-C-28859 Revision B:1990 | CONNECTOR COMPONENT PART, ELECTRICAL BACK PLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR |
| SAE AMS2418J | Plating, Copper |
| MIL-PRF-680 Revision C:2010 | DEGREASING SOLVENT |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| MIL-DTL-28754-94 Revision A:2015 | CONNECTORS, ELECTRICAL, MODULAR, CONNECTOR FRAME, TYPE 4, DIP, 0.4 PITCH, FORMAT C, D AND E |
| MIL A 8625 : F | ANODIC COATINGS FOR ALUMINUM AND ALUMINUM ALLOYS |
| A-A-56032 Revision D:2003 | INK, MARKING, EPOXY BASE |
| SAE AMSP81728B | Plating, Tin-Lead (Electrodeposited) |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
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