MIL-DTL-47113 Revision E:2012
Current
The latest, up-to-date edition.
Compound, Heat Sink, Silicone and/or Non-Silicone
15-05-2012
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Specifies a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
| DevelopmentNote |
Supersedes MIL C 47113 (B). (08/2001) New child NOT 2 2022 is now added.
|
| DocumentType |
Standard
|
| Pages |
13
|
| ProductNote |
New child NOT 2 2022 is now added.
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| Supersedes |
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
| ASTM D 6184 : 2017 : REDLINE | Standard Test Method for Oil Separation from Lubricating Grease (Conical Sieve Method) |
| VV-D-1078 Revision B:1983 | Damping Fluid, Silicone Base (Dimethyl Polysiloxane) |
| ASTM D 217 : 2017 : REDLINE | TEST METHODS FOR CONE PENETRATION OF LUBRICATING GREASE |
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