MIL-HDBK-1250 Revision A Notice 4 - Cancellation:2018

This standard establishes minimum requirements for procedures, materials and systems for protecting electronic components in DoD systems and assemblies from adverse environments.

This standard establishes minimum requirements for procedures, materials and systems for protecting electronic components in DoD systems and assemblies from adverse environments. Protective measures shall be sufficient to maintain performance characteristics within specified limits both during and after exposure to moisture, high and low temperatures, corrosive gases, chemicals and microbial (fungal) attack. This standard does not deal with protection against damage from stress, shock, vibration or nuclear, biological and chemical (NBC) contamination. It is not concerned with electrical or mechanical design except insofar as design details affect susceptibility to corrosion. Provisions for prevention of deterioration shall apply to housings, chassis, hardware and similar parts which are assembled into electronic equipment, as well as to electronic and electro-mechanical components. Unless specifically mentioned in the item specification or drawing, this standard does not apply to standard commercial equipment.