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MIL-HDBK-1857 Base Document:1998

Current

Current

The latest, up-to-date edition.

Grounding, Bonding and Shielding Design Practices

Available format(s)

PDF

Published date

27-03-1998

€17.95
Excluding VAT

Gives the characteristics of grounding, bonding and shielding design practices applicable in the construction and installation of marine, fixed station; transportable and ground mobile electronic equipment, subsystem and system.

DevelopmentNote
Supersedes MIL-STD-1857. (04/2000) NOTICE 1 - Notice of Validation. (12/2013)
DocumentType
Standard
Pages
191
ProductNote
NEW CHILD NOT 2 2019 IS NOW ADDED.
PublisherName
US Military Specs/Standards/Handbooks
Status
Current
Supersedes

This standard covers the characteristics of grounding, bonding and shielding design practices to be applied in the construction and installation of marine, fixed station; transportable and ground mobile electronic equipment, subsystem and system.

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NASA KSC E 166 : 2009 INSTALLATION AND ASSEMBLY, ELECTRICAL GROUND SUPPORT EQUIPMENT (GSE) SPECIFICATION FOR

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MIL-STD-810 Revision G:2008 ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
FED-STD-406 Revision A:1982 PLASTIC, METHODS OF TESTING
MIL-STD-1310 Revision H:2009 SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY
MIL F 14072 : D FINISHES FOR GROUND BASED ELECTRONIC EQUIPMENT
SAE ARP 1173 : 2013 TEST PROCEDURE TO MEASURE THE R.F. SHIELDING CHARACTERISTICS OF E.M.I. GASKETS
MIL-P-11268 Revision L:1983 PART, MATERIALS, AND PROCESSES USED IN ELECTRONIC EQUIPMENT

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