MIL-HDBK-251 Base Document:1978
Current
The latest, up-to-date edition.
Reliability/Design Thermal Applications
English
19-01-1978
| DevelopmentNote |
NEW CHILD NOT 1 2021 IS NOW ADDED
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| DocumentType |
Standard
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| Pages |
698
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| ProductNote |
NEW CHILD NOT 1 2021 IS NOW ADDED
|
| PublisherName |
US Military Specs/Standards/Handbooks
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| Status |
Current
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This handbook recommends and presents electronic parts stress analysis methods which lead to the selection of maximum safe temperatures for parts so that the ensuing thermal design is consistent with the required equipment reliability. These maximum parts temperature must be properly selected since they are the goals of the thermal design, a fact which is often overlooked. Many thermal designs are inadequate because improper maximum parts temperature were selected as design goals. Consequently, the necessary parts stress analysis procedures have been emphasized. Specific step by step thermal design procedures are given in chapter 4.
| MIL-E-16400 Revision H:1987 | Electronic, Interior Communication and Navigation Equipment, Naval Ship and Shore: General Specification for (S/S by MIL-STD-2036) |
| MIL-STD-2218 Base Document:1992 | Thermal Design, Analysis andTest Criteria for Airborne Electronic Equipment |
| MIL-STD-756 Revision B:1981 | RELIABILITY MODELING & PREDICTION (NO S/S DOCUMENT) |
| MIL-DTL-917 Revision F:2014 | Electric Power Equipment, Basic Requirements for |
| MIL E 917 : E | ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS (NAVAL SHIPBOARD USE) |
| SAE AIR1811A | Liquid Cooling Systems |
| MIL-W-21965 Revision D:1988 | Water Cooling of Shipboard Electronic Equipment General Specification for (Future Acquisitions may refer to MIL-HDBK-251, MIL-HDBK-2036, DOD-STD-1399-532 and S9086-SD-STM-010/532) |
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