MIL-HDBK-816 Notice 3 - Validation:2018
Current
The latest, up-to-date edition.
GUIDELINES FOR DEVELOPING RADIATION HARDNESS ASSURANCE DEVICE SPECIFICATIONS
English
16-02-2018
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The primary objective of this document is to provide guidelines and easy to follow procedures for the preparation of detailed device specifications for the procurement of microcircuits and semiconductor devices where radiation Hardness Assurance (RHA) is required.
| DocumentType |
Notice
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| Pages |
1
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| PublisherName |
US Military Specs/Standards/Handbooks
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| Status |
Current
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The primary objective of this document is to provide guidelines and easy to follow procedures for the preparation of detailed device specifications for the procurement of microcircuits and semiconductor devices where radiation Hardness Assurance (RHA) is required. The guidelines are applicable to MIL-M-38510, MIL-PRF-38534, MIL-PRF-38535, and MIL-PRF-19500 microcircuit and semiconductor device detailed specifications, Standard Microcircuit Drawings (SMDs) as well as other contractor prepared specifications such as Source Control Drawings (SOCD), Selected Item Drawings (SID), and Specification Control Drawings (SCD). Recommended procedures are provided for characterizing the radiation response of a part and for obtaining post-irradiation post-irradiation end-point limits for qualification and Lot Acceptance Tests (LAT).
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