MIL-M-38510-371 Revision B:2004
Current
The latest, up-to-date edition.
Microcircuits, Digital, Bipolar, Advanced, Low-Power Schottky TTL, Flip-Flops, Monolithic Silicon
02-09-2004
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Covers the detail requirements for monolithic silicon, advanced, low-power Schottky TTL, flip flops, bistable logic microcircuits.
| DevelopmentNote |
Inactive for New Design. (09/2004) B NOTICE 1 - Notice of Validation but remains Inactive for New Design. (07/2009) B NOTICE 2 - Notice of Validation but remains Inactive for New Design. (04/2014)
|
| DocumentType |
Standard
|
| Pages |
91
|
| PublisherName |
US Military Specs/Standards/Handbooks
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| Status |
Current
|
This specification covers the detail requirements for monolithic silicon, advanced, low-power Schottky TTL, flip flops, bistable logic microcircuits. Two product assurance classes and a choice of case outlines/lead finish are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.3).
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| MIL-STD-1835 Revision D:2004 | ELECTRONIC COMPONENT CASE OUTLINES |
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