MIL-P-70661 Base Document:1987
Current
The latest, up-to-date edition.
Potted Circuit Card Assembly for Tow-2E/6 Probe and S&A Assembly
27-04-1987
Covers requirements, quality assurance provisions, testing and packaging of electronic assembly.
| DevelopmentNote |
NOTICE 1 - Notice of Inactivation for New Design. (05/2014)
|
| DocumentType |
Standard
|
| Pages |
39
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
This specification contains the requirements, quality assurance provisions, testing and packaging of an electronic assembly for TOW-2/E6 Probe and S&A Assembly.
| MIL-P-48698 Base Document:1987 | Probe and S&A Assembly, TOW-2/E6 |
| MIL-STD-275 Revision E:1984 | PRINTED WIRING FOR ELECTRONIC EQUIPMENT (REFER TO IPC-D275 OR IPC-2221) |
| MIL-STD-750 Revision F:2011 | Test Methods for Semiconductor Devices |
| MIL-A-48078 Revision A:1988 | Ammunition, Standard Quality Assurance Provisions, General Specification for |
| MIL R 14293 : A | RESISTOR, FIXED, HIGH MEGOHM (HERMETICALLY SEALED) |
| MIL-STD-105 Revision E:1989 | Sampling Procedures and Tables for Inspection by Attributes (See Notice 3 for Replacement Information) |
| MIL-P-48698 Base Document:1987 | Probe and S&A Assembly, TOW-2/E6 |
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