MIL-PRF-19500-350 Revision M:2015
Current
The latest, up-to-date edition.
Transistor, PNP, Silicon, Low Power Encapsulated (Through-Hole and Surface Mount Packages) and Un-Encapsulated (DIE), Radiation and Non-Radiation Hardened, Types 2N3867, 2N3868, JAN, JANTX, JANTXV, JANS, JANHC, and JANKC
31-08-2015
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Specifies the performance requirements for PNP, silicon, switching transistor.
| DevelopmentNote |
Supersedes MIL S 19500/350 (D). (02/2000)
|
| DocumentType |
Standard
|
| Pages |
67
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| Supersedes |
This specification covers the performance requirements for PNP, silicon, switching transistor. Four levels of product assurance (JAN, JANTX, JANTXV, and JANS) are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance (JANHC and JANKC) are provided for each unencapsulated device type. Provisions for radiation hardness assurance (RHA) to eight radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels.
| MIL-PRF-19500 Revision P:2010 | Semiconductor Devices, General Specification for |
| MIL-STD-750 Revision F:2011 | Test Methods for Semiconductor Devices |
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