MIL-PRF-19500 Revision R:2021
Current
The latest, up-to-date edition.
Semiconductor Devices, General Specification for
English
24-07-2021
| DocumentType |
Standard
|
| Pages |
201
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| Supersedes |
This specification establishes the general performance requirements for semiconductor devices.
Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of
manufacturing date code or conformance inspection (CI) completion date. Four quality levels for hermetic encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Three quality levels for non-hermetic encapsulated devices are provided for in this specification, differentiated by the prefixes JANP, JANPTX, and JANPTXV. Eleven radiation hardness assurance (RHA) levels are provided for the JANPTXV, JANTXV and JANS quality levels. These are designated by the letters E, K, U, M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices (die) are provided for in this specification, differentiated by the prefixes JANHC and JANKC.
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