MIL-PRF-20 Revision N:2017
Current
The latest, up-to-date edition.
CAPACITOR, FIXED, CERAMIC DIELECTRIC, (TEMPERATURE COMPENSATING), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
24-03-2017
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - PROCEDURE FOR QUALIFICATION INSPECTION
Specifies the general requirements for established reliability (ER) and non-ER, temperature compensating, fixed capacitors for use primarily where compensation is necessary for circuit applications due to temperature changes, in bypass and coupling applications.
Committee |
FSC 5910
|
DevelopmentNote |
Supersedes MIL C 20 (08/2001) NEW CHILD NOT 1 2022 IS NOW ADDED.
|
DocumentType |
Standard
|
Pages |
37
|
ProductNote |
NEW CHILD NOT 1 2022 IS NOW ADDED.
|
PublisherName |
US Military Specs/Standards/Handbooks
|
Status |
Current
|
Supersedes |
MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
MIL-DTL-917 Revision F:2014 | ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR |
MIL-PRF-20-36 Revision H:2017 | CAPACITOR, FIXED, CERAMIC DIELECTRIC (TEMPERATURE COMPENSATING), ESTABLISHED AND NON-ESTABLISHED RELIABILITY, STYLES CCR06 AND CC06 |
MIL-PRF-20-35 Revision L:2017 | CAPACITOR, FIXED, CERAMIC DIELECTRIC (TEMPERATURE COMPENSATING), ESTABLISHED AND NON-ESTABLISHED RELIABILITY, STYLES CCR05, CC05, CCR09, AND CC09 |
NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
MIL-PRF-20-28 Revision E:2017 | CAPACITOR, FIXED, CERAMIC DIELECTRIC (TEMPERATURE COMPENSATING), ESTABLISHED AND NON-ESTABLISHED RELIABILITY, STYLES CCR76 AND CC76 |
MIL-HDBK-198 Revision B:2012 | CAPACITORS, SELECTION AND USE OF |
MIL-PRF-20-27 Revision H:2017 | CAPACITOR, FIXED, CERAMIC DIELECTRIC (TEMPERATURE COMPENSATING), ESTABLISHED AND NON-ESTABLISHED RELIABILITY, STYLES CCR75 AND CC75 |
MIL-PRF-20-29 Revision F:2017 | CAPACITORS, FIXED, CERAMIC DIELECTRIC (TEMPERATURE COMPENSATING), ESTABLISHED AND NON-ESTABLISHED RELIABILITY, STYLES CCR77 AND CC77 |
MIL-STD-202-211 Base Document:2015 | METHOD 211, TERMINAL STRENGTH |
MIL-STD-202-302 Base Document:2015 | Method 302, Insulation Resistance |
MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
MIL-STD-202-305 Base Document:2015 | Method 305, Capacitance |
MIL-STD-202-209 Base Document:2015 | METHOD 209, RADIOGRAPHIC INSPECTION |
MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
MIL-STD-202-301 Base Document:2015 | Method 301, Dielectric Withstanding Voltage |
IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
MIL-STD-202-215 Base Document:2015 | METHOD 215, RESISTANCE TO SOLVENTS |
MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
MIL-STD-202-104 Base Document:2015 | Method 104, Immersion |
MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
MIL-STD-202-105 Base Document:2015 | Method 105, Barometric Pressure (Reduced) |
MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
MIL-STD-690 Revision D:2005 | Failure Rate (FR) Sampling Plans and Procedures |
MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
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