MIL-PRF-31032-4 Revision C:2017
Current
The latest, up-to-date edition.
Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
04-08-2017
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Specifies the generic performance requirements for multilayered (three or more conductor layers) rigid-flex or flexible (with or without stiffeners) printed wiring boards (hereafter designated printed board) with plated holes that will use soldering for component/part mounting.
| DocumentType |
Standard
|
| Pages |
84
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
This specification covers the generic performance requirements for multilayered (three or more conductor layers) rigid-flex or flexible (with or without stiffeners) printed wiring boards (hereafter designated printed board) with plated holes that will use soldering for component/part mounting (see 6.1.1).
| MIL-PRF-50884 Revision F:2014 | Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
| MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
| ASTM B 567 : 1998 | Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method |
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