MIL-PRF-55182 Revision J:2017
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Resistor, Fixed, Film, Nonestablished Reliability, Established Reliability, and Space Level, General Specification for
22-05-2017
13-10-2020
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - PROCEDURE FOR QUALIFICATION INSPECTION
APPENDIX B - PROCEDURES FOR DESTRUCTIVE PHYSICAL ANALYSIS
(SPACE LEVEL ONLY)
Describes the general requirements for nonestablished reliability (non-ER), established reliability (ER), and space level that are hermetically or nonhermetically sealed fixed film resistors that have a high degree of stability with respect to time under severe environmental conditions.
| DevelopmentNote |
Supersedes MIL R 55182 (F). (01/2002)
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| DocumentType |
Standard
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| Pages |
53
|
| PublisherName |
US Military Specs/Standards/Handbooks
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
This specification covers the general requirements for nonestablished reliability (non-ER), established reliability (ER), and space level that are hermetically or nonhermetically sealed fixed film resistors that have a high degree of stability with respect to time under severe environmental conditions. ER resistors have failure rates (FR) that are established at 60 percent confidence ranging from 0.001 percent per 1,000 hours to 1.0 percent per 1,000 hours. Designers are CAUTIONED on using these resistors in high power pulse applications (see 6.9).
| MIL-STD-1580 Revision B:2003 | Destructive Physical Analysis for Electronic, Electromagnetic, and Electromechanical Parts |
| MIL-R-10509 Revision J:2007 | RESISTOR, FIXED, FILM (HIGH STABILITY) GENERAL SPECIFICATION FOR |
| MIL-HDBK-773 Revision A:2005 | Electrostatic Discharge Protective Packaging |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| MIL R 55182/12 : E | RESISTOR, FIXED, FILM, ESTABLISHED RELIABILITY, STYLE RN*56 1/ |
| MIL-PRF-83726-31 Revision K:2018 | Relay, Hybrid, Time Delay (On Release), Class B, Type IIA, Hermetically Sealed, DPDT, 10 Amperes, Adjustable Time Delay (External Resistor), 0.1 to 500 Seconds |
| MIL-PRF-55182-3 Revision R:2002 | Resistor, Fixed, Film, Nonestablished Reliability, Established Reliability, and Space Level, Style RN*60 1/ |
| MIL-HDBK-199 Revision D:2018 | Resistors, Selection and Use of |
| MIL-DTL-39032 Revision E:2000 | Resistors, Packaging of |
| DSCC 06021 : D | RESISTOR, FIXED, BULK METAL FOIL, HIGH PRECISION, SURFACE MOUNT, MOLDED 0.6/.4 WATTS |
| MIL-PRF-55182-5 Revision M:2002 | Resistor, Fixed, Film, Nonestablished Reliability, Established Reliability, and Space Level, Style RN*65 1/ |
| MIL-PRF-55182-6 Revision P:2002 | Resistor, Fixed, Film, Nonestablished Reliability, Established Reliability, and Space Level, Style RN*70 1/ |
| MIL-PRF-55182-7 Revision M:2002 | Resistor, Fixed, Film, Nonestablished Reliability, Established Reliability, and Space Level, Style RN*50 1/ |
| MIL-PRF-55182-1 Revision P:2002 | Resistor, Fixed, Film, Nonestablished Reliability, Established Reliability, and Space Level, Style RN*55 1/ |
| DSCC 06020 : D | RESISTOR, FIXED, BULK METAL FOIL, HIGH PRECISION, SURFACE-MOUNT, MOLDED .25/.16 WATT |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| MIL-PRF-55182-13 Revision B:2002 | RESISTORS, FIXED, FILM, NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, AND SPACE LEVEL, STYLE RN*77 (NO S/S DOCUMENT) |
| MIL-PRF-55182-2 Revision K:2002 | Resistor, Fixed, Film, Nonestablished Reliability, Established Reliability, and Space Level, Style RN*57 1/ |
| MIL-PRF-83726-30 Revision K:2018 | Relay, Hybrid, Time Delay (On Operate), Class B, Type I, Hermetically Sealed, DPDT, 10 Amperes, Adjustable Time Delay (External Resistor), 0.1 to 500 Seconds |
| MIL-PRF-83726-21 Revision H:2015 | Relay, Solid-State, Time Delay (on Operate), Type I, Class C, SPST, 250 Milliamperes, Variable Time, 0.05 to 500 Seconds |
| MIL-PRF-55182-10 Revision E:2002 | Resistor, Fixed, Film, Nonestablished Reliability, Established Reliability, and Space Level, Style RN*75 1/ |
| MIL-PRF-55182-9 Revision G:2002 | Resistor, Fixed, Film, Nonestablished Reliability, Established Reliability, and Space Level, Style RN*90 1/ |
| MIL R 55182/11 : E | RESISTOR, FIXED, FILM, ESTABLISHED RELIABILITY, STYLE RN*51 1/ |
| DSCC 09002 : 0 | RESISTOR, FIXED, FILM, PRECISION, HIGH OHMIC VALUES |
| DSCC 87026 : P | RESISTOR NETWORK, FIXED, FILM, 3-PIN |
| DSCC 89039 : G | RESISTOR, FIXED, FILM, PRECISION |
| MIL-STD-202-211 Base Document:2015 | Method 211, Terminal Strength |
| MIL-STD-202-302 Base Document:2015 | Method 302, Insulation Resistance |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| MIL-STD-202-304 Base Document:2015 | Method 304, Resistance-Temperature Characteristic |
| MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| ASTM E 595 : 2015 : REDLINE | Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment |
| MIL-STD-202-309 Base Document:2015 | Method 309, Voltage Coefficient of Resistance Determination Procedure |
| MIL-STD-202-107 Base Document : 2015 | Method 107, Thermal Shock |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-STD-202-301 Base Document:2015 | Method 301, Dielectric Withstanding Voltage |
| MIL-STD-202-215 Base Document:2015 | Method 215, Resistance to Solvents |
| MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| MIL-STD-202-105 Base Document:2015 | Method 105, Barometric Pressure (Reduced) |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| MIL-STD-1285 Revision D:2004 | Marking of Electrical and Electronic Parts |
| EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
| MIL-STD-690 Revision D:2005 | Failure Rate (FR) Sampling Plans and Procedures |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
| MIL-STD-202-112 Base Document:2015 | Test Method Standard Method 112, Seal |
| MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
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