MIL PRF 55365 : 0012
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR
03-08-2023
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - PROCEDURES FOR QUALIFICATION INSPECTION
Specifies the general requirements for non-established reliability (non-ER), established reliability (ER), and high reliability (T level) tantalum dielectric, fixed, chip capacitors, primarily intended for use in thick and thin film hybrid circuits or surface mount applications for filter, bypass, coupling, and other applications where the alternating current (ac) component is small compared to the direct current (dc) rated voltage and where supplemental moisture protection is available.
| Committee |
FSC 5910
|
| DevelopmentNote |
SUPERSEDES MIL C 55365. (05/2001) Inactive for new design. (06/2003)
|
| DocumentType |
Standard
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Withdrawn
|
| Supersedes |
| MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
| DSCC 09009 : 0 | CAPACITOR, FIXED, TANTALUM CHIP MODULE, LOW ESR |
| MIL-PRF-39003 Revision N:2016 | Capacitor, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| DSCC 11020 : A | CAPACITOR, FIXED, TANTALUM CHIP, WEIBULL GRADED |
| DSCC 95158 : F | CAPACITOR, FIXED, TANTALUM CHIP, LOW ESR |
| DSCC 02006 : B | CAPACITORS, FIXED, TANTALUM, CHIP |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| DSCC 13008 : A | CAPACITORS, FIXED, MULTIPLE ANODE TANTALUM, CHIP, CONFORMAL COATED CASE |
| DSCC 14002 : B | CAPACITOR, FIXED, TANTALUM, CHIP, CONFORMAL COATED CASE |
| DSCC 04051 : B | CAPACITOR, FIXED, POLYMER TANTALUM CHIP |
| MIL-PRF-55365-12 Revision F:2012 | CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY AND NONESTABLISHED RELIABILITY, STYLE CWR15 |
| DSCC 07016 : C | CAPACITOR, FIXED, TANTALUM CHIP, WEIBULL GRADED, LOW ESR |
| DSCC 04053 : E | CAPACITOR, FIXED, FUSED TANTALUM CHIP, NON-WEIBULL GRADED AND WEIBULL GRADED |
| MIL-HDBK-198 Revision B:2012 | CAPACITORS, SELECTION AND USE OF |
| DSCC 04052 : B | CAPACITOR, FIXED, MULTIPLE ANODE POLYMER TANTALUM CHIP |
| DSCC 02002 : B | CAPACITORS, FIXED, TANTALUM, CHIP |
| MIL-PRF-55365-11 Revision D:2014 | CAPACITOR, CHIP, FIXED, TANTALUM, POLARIZED, ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY AND HIGH RELIABILITY, STYLES CWR19 AND CWR29 |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-202-305 Base Document:2015 | Method 305, Capacitance |
| MIL-STD-202-209 Base Document:2015 | METHOD 209, RADIOGRAPHIC INSPECTION |
| MIL-PRF-55365-8 Revision J:2014 | CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY AND HIGH RELIABILITY, STYLE CWR11 (METRIC) |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-PRF-55365-13 Revision B:2012 | CAPACITOR, CHIP, FIXED, TANTALUM, POLARIZED, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CWR16 AND CWR26 |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| MIL-STD-202-215 Base Document:2015 | METHOD 215, RESISTANCE TO SOLVENTS |
| MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| MIL-PRF-55365-4 Revision J:2014 | CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY, AND HIGH RELIABILITY STYLES CWR06 AND CWR09 |
| MIL-PRF-55365-12 Revision F:2012 | CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY AND NONESTABLISHED RELIABILITY, STYLE CWR15 |
| EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
| MIL-STD-690 Revision D:2005 | Failure Rate (FR) Sampling Plans and Procedures |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
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