MIL-PRF-914 Revision C:2008
Current
Current
The latest, up-to-date edition.
RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, NONESTABLISHED RELIABILITY, AND ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - PROCEDURE FOR QUALIFICATION INSPECTION
APPENDIX B - DIE AND WIRE BOND INSPECTION
Specifies the general requirements for nonestablished reliability (non-ER) and established reliability (ER), hermetically sealed and nonhermetically sealed networks.
| Committee |
FSC 5905
|
| DevelopmentNote |
Supersedes MIL R 914. (05/2001)
|
| DocumentType |
Standard
|
| Pages |
162
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| Supersedes |
| DSCC 88016 : C | RESISTOR NETWORKS, FIXED, FILM, 20 PIN, LEADLESS CHIP CARRIER |
| MIL-PRF-914-1 Revision A:1997 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 14-PIN, SMALL OUTLINE, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS010 |
| MIL-HDBK-199 Revision D:2018 | Resistors, Selection and Use of |
| MIL-DTL-39032 Revision E:2000 | RESISTORS, PACKAGING OF |
| DSCC 87012 : H | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, GULL WING, 16 PIN |
| DSCC 87017 : K#INA | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 20 PIN, LEADLESS CHIP CARRIER |
| DSCC 87018 : H | RESISTOR NETWORK, 16-PIN LEADLESS CHIP CARRIER |
| DSCC 88036 : B | RESISTOR NETWORK, 10 PIN, LEADLESS CHIP CARRIER |
| DSCC 88020 : C | RESISTOR NETWORK, 6-PIN, LEADLESS CHIP CARRIER |
| DSCC 87016 : N | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 20 PIN, LEADLESS CHIP CARRIER |
| DSCC 87015 : F | RESISTOR NETWORKS, FIXED, FILM, SURFACE MOUNT, 28 PIN, LEADLESS CHIP CARRIER |
| DSCC 87014 : K | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16 PIN, LEADLESS CHIP CARRIER |
| MIL-PRF-914-5 Revision B:2008 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS050 |
| MIL-PRF-914-4 Revision B:2008 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 20-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS040 |
| MIL-PRF-914-3 Revision B:2008 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS030 |
| DSCC 87013 : H | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, GULL WING, 14 PIN |
| MIL-STD-202-302 Base Document:2015 | Method 302, Insulation Resistance |
| MIL-PRF-914-4 Revision B:2008 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 20-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS040 |
| MIL-STD-202-304 Base Document:2015 | Method 304, Resistance-Temperature Characteristic |
| MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| MIL-STD-202-303 Base Document:2015 | Method 303, DC Resistance |
| MIL-PRF-914-3 Revision B:2008 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS030 |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-STD-202-301 Base Document:2015 | Method 301, Dielectric Withstanding Voltage |
| MIL-STD-202-215 Base Document:2015 | METHOD 215, RESISTANCE TO SOLVENTS |
| MIL-STD-790 Revision G:2011 | Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications |
| MIL-PRF-914-5 Revision B:2008 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS050 |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
| MIL-STD-690 Revision D:2005 | Failure Rate (FR) Sampling Plans and Procedures |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
| MIL-STD-202-112 Base Document:2015 | METHOD 112, SEAL |
| MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
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