MIL-STD-202-208 Revision A:2020
Current
The latest, up-to-date edition.
Method 208, Solderability
English
26-01-2020
Important note : Users cannot be edited or removed once added to your Multi user PDF.| DocumentType |
Standard
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| Pages |
7
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| PublisherName |
US Military Specs/Standards/Handbooks
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| Status |
Current
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The purpose of this test method is to determine the solderability of all terminations which are normally joined by a soldering operation. This determination is made on the basis of the ability of these terminations to be wetted by solder and the predictability of a suitable fillet resulting from solder application. These procedures will verify that the pre-assembly lead finish provides a solderable surface of sufficient quality to enable satisfactory soldering.
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| DSCC 87014M:2024 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16 PIN, LEADLESS CHIP CARRIER |
| DSCC 02005C:2024 | RESISTOR, VARIABLE, NONWIREWOUND (ADJUSTMENT TYPE, LEAD-SCREW ACTUATED) 1/2" RECTANGULAR, 0.3 WATTS |
| DSCC 07002E:2024 | RESISTOR, FIXED, WIREWOUND, SURFACE MOUNT POWER TYPE (3 WATT) |
| DSCC 87015H:2024 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 28 PIN, LEADLESS CHIP CARRIER |
| DSCC 87016R:2024 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 20 PIN, LEADLESS CHIP CARRIER |
| DSCC 06011E:2023 | Resistor, Chip, Fixed, Power Metal Strip, Surface Mount, Low Value (1.0 Watt), Style 2512 |
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