MIL-STD-2118 Base Document:1984
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
Available format(s)
PDF
Superseded date
27-08-1999
Superseded by
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.Criteria governing flexible and rigid to flexible and design considerations for mounting parts and assemblies upon them.
| Committee |
FSC 4730
|
| DocumentType |
Standard
|
| Pages |
53
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
| DOD-STD-2000-1 Revision B:1986 | SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
| DOD-STD-2000-4 Revision A:1987 | GENERAL PURPOSE SOLDERING REQUIREMENT FOR ELECTRICAL AND ELECTRONIC EQUIPMENT |
| MIL-C-28809 Revision B:1988 | CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX |
| MIL-STD-2000 Revision A:1991 | STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| DOD-STD-2000-2 Revision A:1986 | PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL-STD-100 Revision G:1997 | ENGINEERING DRAWINGS |
| ASTM F 683 : 2014 : REDLINE | Standard Practice for Selection and Application of Thermal Insulation for Piping and Machinery |
| MIL-STD-1861 Revision A:1993 | ELECTRICAL & ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE, SELECTION AND USE OF |
| MIL-STD-1547 Revision B:1992 | ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL-STD-130 Revision N:2007 | IDENTIFICATION MARKING OF U.S. MILITARY PROPERTY |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
| QQ-C-576 Revision B:1961 | COPPER FLAT PRODUCTS WITH SLIT, SLIT AND EDGE-ROLLED, SHEARED, SAWED OR MACHINED EDGES, (PLATE, BAR, SHEET, AND STRIP) |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
| MIL G 45204 : C | GOLD PLATING, ELECTRODEPOSITED |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEGREES C) |
| MIL-C-14550 Revision B:1983 | COPPER PLATING (ELECTRODEPOSITED) |
| MIL-P-81728 Revision A:1973 | PLATING, TIN LEAD, (ELECTRODEPOSITED) |
| IPC D 350 : 0 | PRINTED BOARD DESCRIPTION IN DIGITAL FORM |
| IPC FC 241 : C1992 AMD 1 1995 | FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING |
| QQ-W-343 Revision G:1997 | WIRE, ELECTRICAL, COPPER (UNINSULATED) |
| MIL P 28809 : A | PRINTED WIRING ASSEMBLIES |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) |
| IPC FC 150 : E | COPPER FOIL FOR PRINTED WIRING APPLICATIONS |
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