MIL-STD-275 Revision E:1984

1. SCOPE
1.1 Purpose
1.2 Classification
2. REFERENCED DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
4.1 Design features
4.2 Documentation
4.3 Master drawing
4.4 Printed-wiring assembly drawing
4.5 Production master
5. DETAIL BOARD REQUIREMENTS
5.1 Conductive pattern
5.2 Lands
5.3 Holes
5.4 Eyelets and standoff terminals
5.5 Plated-through holes
5.6 Materials
5.7 Printed-wiring board dimensions
5.8 Detail board marking requirements
5.9 Quality conformance testing circuitry
6. DETAIL PART MOUNTING REQUIREMENTS
6.1 Approved methods of attachment
6.2 Electrical part mounting
6.3 Conformal coating
6.4 Support
6.5 Detailed assembly marking requirements
APPENDIX
10. SCOPE
10.1 Purpose
20. DESIGN CONSIDERATIONS
20.1 Design process tolerances and allowances
20.2 Board dimensions
20.3 Dimensional stability
20.4 Dielectric constant and dissipation factor
20.5 Surface prepartion of large conductive areas
20.6 High voltage factors
TABLES
I. Conductor spacing
II. Standard fabrication allowances for plated-through
      hole attachment
III. Standard fabrication allowances for surface
      attachments
IV. Clad laminates
V. Conformance test circuitry
VI. Composite board design guidance
FIGURES
1. Quality conformance test circuitry
2. Block diagram depicting typical printed wiring
      drawing relationships
3. Use of grids in defining pattern requirements
4. Conductor thickness and width
5. Discrete leadless component land pattern
6. Chip carrier land pattern
7. Modified fan-out patterns
8. Heel mounting requirements
9. Typical flat pack land
10. Coined or flattened lead lands
11. Annular ring requirements (external)
12. Annular ring requirements (internal
13. Minimum annular ring dimensions (external)
14. Ground plan lands (typical)
15. Hole diameter for flat lead
16. Dielectric layer thickness measurement
17. Location of test coupon based on number of boards
      fabricated per panel
18. Flat lead termination
19. Lead bend
20. Perpendicular part mounting

Covers design requirements for various printed-wiring boards. The coverage includes referenced documents, definitions, documentation, master drawing, production master, conductive pattern, materials, electrical part mounting, quality conformance testing circuitry, detailed assembly marking requirements, board dimensions, plated through holes, dimensional stability, conductor spacing, composite board design guidance, eyelets & stand-off terminals.