NASA GSFC STD 6001 : 2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE
Hardcopy , PDF
01-08-2024
English
21-04-2016
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DOCUMENT HISTORY LOG
FOREWORD
1.0 SCOPE
2.0 APPLICABLE DOCUMENTS
3.0 ACRONYMS AND DEFINITIONS
4.0 REQUIREMENTS
Appendix A - Technology Background
Specifies requirements and recommendations intended to facilitate production of defect-free ceramic column grid array solder joint interconnects to boards intended for use in space flight applications.
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
National Aeronautics and Space Administration
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| NASA GSFC STD 8002 : 2015 | STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| NASA STD 8739.1 : 2016 | WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| NASA STD 8739.2 : 1999 | WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| SAE AS9100D | Quality Management Systems - Requirements for Aviation, Space, and Defense Organizations |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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