NASA GSFC-STD-6001:2021
Current
Current
The latest, up-to-date edition.
Area Array Package Assembly and Manufacturing Practices for Flight Hardware
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
30-07-2021
Free
Excluding VAT
The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free area array solder joint interconnects to printed circuit boards intended for use in Flight, Flight Spare and Custom Mission Critical Support Hardware applications.
| DocumentType |
Standard
|
| Pages |
17
|
| ProductNote |
THIS STANDARD IS ALSO REFER TO IPC-6012S,IPC J-STD-001S,GSFC-STD-7000,GPR 8705.4
|
| PublisherName |
National Aeronautics and Space Administration
|
| Status |
Current
|
| Supersedes |
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