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NASA MSFC SPEC 3659 : 2012

Current

Current

The latest, up-to-date edition.

PROCESS SPECIFICATION FOR ELECTRICAL BONDING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

08-02-2012

1.0 INTRODUCTION
2.0 APPLICABLE DOCUMENTS
3.0 REQUIREMENTS
4.0 VERIFICATION
5.0 PACKAGING
6.0 NOTES
APPENDIX A - DEFINITIONS AND ACRONYMS

Sets up criteria for the processes involved in electrical bonding of semi-permanent, metal-to-metal joints (joints held together by bolts, rivets, clamps, etc.) and indirect bonds for equipment and elements manufactured at the Marshall Space Flight Center (MSFC).

DocumentType
Standard
Pages
13
PublisherName
National Aeronautics and Space Administration
Status
Current

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