NASA MSFC STD 2907 : 2006
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
Hardcopy , PDF
22-06-2009
English
01-01-2006
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DOCUMENT HISTORY LOG
FOREWORD
1.0 SCOPE
2.0 APPLICABLE DOCUMENTS
3.0 DEFINITIONS
4.0 GENERAL REQUIREMENTS
4.1 Classification
4.2 Qualification
4.3 Deviation and Waiver Requests
4.4 Quality Management System
4.5 Materials
4.5.1 Metal-Clad Laminates
4.5.2 Bonding Layer (Prepreg)
4.5.3 Plating or Solder Coating
4.5.4 Electroless Copper Plating
4.5.5 Electrolytic Copper Plating
4.5.6 Tin-Lead Plating
4.5.7 Solder Coating
4.5.8 Gold Plating
4.5.9 Nickel Plating
4.5.10 Solder Mask
4.5.11 Marking Ink
4.5.12 Solvents
4.6 Quality Conformance Test Circuitry
4.6.1 Type 1 and Type 2
4.6.2 Type 3
5.0 DETAILED REQUIREMENTS
5.1 Dimensions
5.1.1 Hole Patterns
5.1.2 Overall
5.2 Conductor Width and Spacing
5.3 Measling and Crazing
5.4 Delamination
5.5 Undercutting
5.6 Conductor Outgrowth
5.7 Bow and Twist
5.8 Plating Adhesion
5.9 Dielectric Withstanding Voltage
5.10 Cleanliness
5.11 Marking
5.12 Solder Mask
5.13 Specific Requirements
5.13.1 Plating or Coating Thickness
5.13.2 Annular Ring
5.14 Specific Requirements
5.14.1 Plated-Through Hole
5.14.2 Hole Cleaning and Etchback (Type 3 Only)
5.14.3 Plating and Coating Thickness
5.14.4 Annular Ring
5.14.5 Dielectric Layer Thickness
5.14.6 Layer-to-Layer Registration
5.14.7 Thermal Stress
5.14.8 Hole Solderability
5.14.9 Rework Solderability
5.14.10 Circuitry (Type 3 Only)
5.14.11 Thermal Shock
5.15 Quality Assurance Provisions
5.15.1 Responsibility for Inspection
5.15.2 Test Equipment and Inspection Facilities
5.15.3 Classifications of Inspection
5.15.4 Materials Inspection
5.15.5 Supplier Qualification Inspection
5.15.6 Quality Conformance Inspection
5.15.7 Inspection Lot
5.15.8 Sampling Plan
6.0 NOTES
Sets forth requirements for rigid printed wiring boards (PWB's).
| DocumentType |
Standard
|
| Pages |
27
|
| PublisherName |
National Aeronautics and Space Administration
|
| Status |
Withdrawn
|
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| SAE AMSQQN290C | Nickel Plating (Electrodeposited) |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| A-A-56032 Revision D:2003 | INK, MARKING, EPOXY BASE |
| ANSI/ISO/ASQ Q9001:2008 | Quality Management Systems - Requirements |
| SAE AMSP81728B | Plating, Tin-Lead (Electrodeposited) |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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