NBN EN 60384-20 : 2008

Section 1: General
1 General
1.1 Scope
1.2 Object
1.3 Normative references
1.4 Information to be given in a detail specification
1.5 Terminology
1.6 Marking
Section 2: Preferred Ratings and Characteristics
2 Preferred ratings and characteristics
2.1 Preferred characteristics
2.2 Preferred values of ratings
Section 3: Quality Assessment Procedures
3 Quality assessment procedures
3.1 Primary stage of manufacture
3.2 Structurally similar components
3.3 Certified records of released lots
3.4 Qualification approval
3.5 Quality conformance inspection
Section 4: Test and Measurement Procedures
4 Test and measurement procedures
4.1 Mounting
4.2 Visual examination and check of dimensions
4.3 Electrical tests
4.4 Adhesions
4.5 Bond strength of the end face plating
4.6 Resistance to soldering heat
4.7 Solderability
4.8 Rapid change of temperature
4.9 Climatic sequence
4.10 Damp heat, steady state
4.11 Endurance
4.12 Charge and discharge
4.13 Component solvent resistance
4.14 Solvent resistance of the marking
Annex ZA Normative references to international publications with
         their corresponding European publications

Defines fixed chip capacitors for direct current, with metallized electrodes and polyphenylene sulfide dielectric for use in electronic equipment. Metallized connecting pads or soldering strips that are intended to be mounted directly onto substrates for hybrid circuits or onto printed boards. These may have "self-healing properties" depending on conditions of use. Primarily intended for applications where the a.c. component is small with respect to the rated voltage. Not applicable are the capacitors for radio interference suppression.