1 General
1.1 Scope
1.2 Normative references
1.3 Order of precedence
2 Terminology and general requirements
2.1 General
2.2 Definitions
2.3 Preferred values for ratings and characteristics
2.4 Marking
3 Quality assessment procedures
3.1 Primary stage of manufacture
3.2 Structurally similar components
3.3 Subcontracting
3.4 Incorporated components
3.5 Manufacturer's approval
3.6 Approval procedures
3.7 Procedures for capability approval
3.8 Procedures for qualification approval
3.9 Test procedures
3.10 Screening requirements
3.11 Rework and repair work
3.12 Certified test records
3.13 Validity of release
3.14 Release for delivery
3.15 Unchecked parameters
4 Test and measurement procedures
4.1 General
4.2 Test and measurement conditions
4.2.1 Standard conditions for testing
4.2.2 Equilibrium conditions
4.2.3 Air flow conditions for temperature tests
4.2.4 Power supplies
4.2.5 Precision of measurement
4.2.6 Precautions
4.2.7 Alternative test methods
4.3 Visual inspection
4.4 Dimensions and gauging procedures
4.5 Electrical test procedures
4.5.1 Insulation resistance
4.5.2 Voltage proof
4.5.3 Input power
4.5.4 Output frequency
4.5.5 Frequency/temperature characteristics
4.5.6 Frequency/load coefficient
4.5.7 Frequency/voltage coefficient
4.5.8 Frequency stability with thermal transient
4.5.9 Oscillation start-up
4.5.10 Stabilization time
4.5.11 Frequency adjustment range
4.5.12 Retrace characteristics
4.5.13 Oscillator output voltage (sinusoidal)
4.5.14 Oscillator output voltage (pulse waveform)
4.5.15 Oscillator output waveform (sinusoidal)
4.5.16 Oscillator output waveform (pulse)
4.5.17 Oscillator output power (sinusoidal)
4.5.18 Oscillator output impedance (sinusoidal)
4.5.19 Re-entrant isolation
4.5.20 Output suppression of gated oscillators
4.5.21 Tri-state output characteristics
4.5.22 Amplitude modulation characteristics
4.5.23 Frequency modulation characteristics
4.5.24 Spurious response
4.5.25 Phase noise
4.5.26 Phase noise - vibration
4.5.27 Phase noise - acoustic
4.5.28 Noise pedestal
4.5.29 Spectral purity
4.5.30 Incidental frequency modulation
4.5.31 RMS fractional frequency fluctuations
4.5.32 Electromagnetic interference (radiated)
4.6 Mechanical and environmental test procedures
4.6.1 Robustness of terminations (destructive)
4.6.2 Sealing tests (non-destructive)
4.6.3 Soldering (solderability and resistance to
soldering heat)(destructive)
4.6.4 Rapid change of temperature: severe shock by
liquid immersion (non-destructive)
4.6.5 Rapid change of temperature: thermal
shock in air (non-destructive)
4.6.6 Bump (destructive)
4.6.7 Vibration (destructive)
4.6.8 Shock (destructive)
4.6.9 Free fall (destructive)
4.6.10 Acceleration, steady-state (non-destructive)
4.6.11 Acceleration - 2g tip over
4.6.12 Acoustic noise
4.6.13 Low air pressure (non-destructive)
4.6.14 Dry heat (non-destructive)
4.6.15 Damp heat, cyclic (destructive)
4.6.16 Cold (non-destructive)
4.6.17 Climatic sequence (destructive)
4.6.18 Damp heat, steady-state (destructive)
4.6.19 Salt mist, cyclic (destructive)
4.6.20 Mould growth (non-destructive)
4.6.21 Immersion in cleaning solvents
(non-destructive)
4.6.22 Radiation hardness
4.7 Endurance test procedure
4.7.1 Ageing (non-destructive)
4.7.2 Extended ageing (non-destructive)
4.7.3 Power consumption ageing
Annexes
A (normative) Load circuit for logic drive
B (informative) Electrostatic discharge sensitivity
classification
ZA (normative) Normative references to international
publications with their corresponding
European publications
Bibliography