• NBN EN 61192-5 : 2007

    Current The latest, up-to-date edition.


    Available format(s): 


    Published date:  12-01-2013

    Publisher:  Belgian Standards

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Terminology
       3.1 Terms and definitions
       3.2 Abbreviations
    4 Classification of rework activities
       4.1 Pre-soldering rework
       4.2 Post-soldering rework
       4.3 Essential prerequisites for successful and reliable
    5 Pre-soldering rework
       5.1 General
       5.2 Reworking solder paste and non-conducting adhesive
            5.2.1 General
            5.2.2 General misalignment or smudging of deposits
            5.2.3 Local misalignment or smudging of deposit
            5.2.4 General paste or adhesive quantity incorrect
            5.2.5 Local paste or adhesive quantity incorrect
       5.3 Reworking placed components
            5.3.1 General overall component misalignment
            5.3.2 Local component misalignment
       5.4 Realigning components after curing thermoplastic
       5.5 Realigning components after curing thermosetting
    6 Factors affecting post-soldering rework
       6.1 Component marking and unmarked components
       6.2 Reuse of removed components
       6.3 Sensitive components
       6.4 Printed board layout design and space constraints
       6.5 Heat-sink effects
       6.6 Printed board material type
       6.7 Solder resist material and aperture size
       6.8 Reworking individual fine pitch device leads
       6.9 Reworking grid arrays
    7 Preparation for post-soldering rework and repair
       7.1 Electrostatic precautions
       7.2 Avoiding exposure of components to contaminants
       7.3 Removal of conformal coating
       7.4 Unsuitable components
       7.5 Cleaning prior to rework
       7.6 Protecting adjacent sensitive components
       7.7 Baking of assemblies prior to component replacement
       7.8 Preheating large multilayer boards
       7.9 Preheating replacement sensitive components
    8 Post-soldering rework
       8.1 General
       8.2 Component realignment (tweaking)
       8.3 Component removal
       8.4 Removal of adjacent components
       8.5 Reuse of components
       8.6 Addition of flux and solder
       8.7 Topping-up
       8.8 Removal of excess solder from joints
       8.9 Preparation of lands before component replacement
       8.10 Component replacement
       8.11 Cleaning (if required)
       8.12 Visual inspection and electrical testing
       8.13 Checking thermal integrity of solder joints
       8.14 Replacement of local conformal coating (if required)
    9 Selection of rework equipment, tools and methods
       9.1 General
       9.2 Matching rework equipment to component and
            printed-board prerequisites
            9.2.1 General
            9.2.2 Selection based on component types on the
                  printed board
            9.2.3 Selection based on printed-board laminate
                  material type
            9.2.4 Selection based on assembly structure and
                  soldering processes
    10 Manual rework tools and methods
       10.1 General
       10.2 Miniature conventional (stored energy) soldering irons
       10.3 Directly heated soldering irons
       10.4 Hot air/gas pencils
       10.5 Heated tweezers
       10.6 Soldering irons with special tips
    11 Mechanized and programmable rework machines
       11.1 General
       11.2 Hot air rework machines
       11.3 Focused infrared (IR) equipment
       11.4 Thermode (heated electrode) equipment
       11.5 Laser equipment for de-soldering
    12 Ancillary tools and equipment
       12.1 Conventional soldering irons
       12.2 Hotplates
       12.3 Pneumatic dispensers
       12.4 De-soldering tools, as used for through-hole assemblies
       12.5 Tweezers and vacuum pencils
       12.6 Solder pots
       12.7 Copper braid
    13 Rework recording procedures
       13.1 General
       13.2 Anomaly charts
       13.3 Travelling documents
       13.4 Rework status
    14 Training of operators and inspectors
    15 Field repair
    Annex ZA (normative) Normative references to international
             publications with their corresponding European

    Abstract - (Show below) - (Hide below)

    Provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Belgian Standards
    Status Current
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