• BS EN 61192-5 : 2007

    Current The latest, up-to-date edition.

    WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2007

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Terminology
       3.1 Terms and definitions
       3.2 Abbreviations
    4 Classification of rework activities
       4.1 Pre-soldering rework
       4.2 Post-soldering rework
       4.3 Essential prerequisites for successful and reliable
            rework
    5 Pre-soldering rework
       5.1 General
       5.2 Reworking solder paste and non-conducting adhesive
            deposits
            5.2.1 General
            5.2.2 General misalignment or smudging of deposits
            5.2.3 Local misalignment or smudging of deposit
            5.2.4 General paste or adhesive quantity incorrect
            5.2.5 Local paste or adhesive quantity incorrect
       5.3 Reworking placed components
            5.3.1 General overall component misalignment
            5.3.2 Local component misalignment
       5.4 Realigning components after curing thermoplastic
            adhesive
       5.5 Realigning components after curing thermosetting
            adhesive
    6 Factors affecting post-soldering rework
       6.1 Component marking and unmarked components
       6.2 Reuse of removed components
       6.3 Sensitive components
       6.4 Printed board layout design and space constraints
       6.5 Heat-sink effects
       6.6 Printed board material type
       6.7 Solder resist material and aperture size
       6.8 Reworking individual fine pitch device leads
       6.9 Reworking grid arrays
    7 Preparation for post-soldering rework and repair
       7.1 Electrostatic precautions
       7.2 Avoiding exposure of components to contaminants
       7.3 Removal of conformal coating
       7.4 Unsuitable components
       7.5 Cleaning prior to rework
       7.6 Protecting adjacent sensitive components
       7.7 Baking of assemblies prior to component replacement
       7.8 Preheating large multilayer boards
       7.9 Preheating replacement sensitive components
    8 Post-soldering rework
       8.1 General
       8.2 Component realignment (tweaking)
       8.3 Component removal
       8.4 Removal of adjacent components
       8.5 Reuse of components
       8.6 Addition of flux and solder
       8.7 Topping-up
       8.8 Removal of excess solder from joints
       8.9 Preparation of lands before component replacement
       8.10 Component replacement
       8.11 Cleaning (if required)
       8.12 Visual inspection and electrical testing
       8.13 Checking thermal integrity of solder joints
       8.14 Replacement of local conformal coating (if required)
    9 Selection of rework equipment, tools and methods
       9.1 General
       9.2 Matching rework equipment to component and
            printed-board prerequisites
            9.2.1 General
            9.2.2 Selection based on component types on the
                  printed board
            9.2.3 Selection based on printed-board laminate
                  material type
            9.2.4 Selection based on assembly structure and
                  soldering processes
    10 Manual rework tools and methods
       10.1 General
       10.2 Miniature conventional (stored energy) soldering irons
       10.3 Directly heated soldering irons
       10.4 Hot air/gas pencils
       10.5 Heated tweezers
       10.6 Soldering irons with special tips
    11 Mechanized and programmable rework machines
       11.1 General
       11.2 Hot air rework machines
       11.3 Focused infrared (IR) equipment
       11.4 Thermode (heated electrode) equipment
       11.5 Laser equipment for de-soldering
    12 Ancillary tools and equipment
       12.1 Conventional soldering irons
       12.2 Hotplates
       12.3 Pneumatic dispensers
       12.4 De-soldering tools, as used for through-hole assemblies
       12.5 Tweezers and vacuum pencils
       12.6 Solder pots
       12.7 Copper braid
    13 Rework recording procedures
       13.1 General
       13.2 Anomaly charts
       13.3 Travelling documents
       13.4 Rework status
    14 Training of operators and inspectors
    15 Field repair
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes 02/208154 DC. (08/2007)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
    EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    IPC 7711 : 1998 REWORK OF ELECTRONIC ASSEMBLIES
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 61190-1-1 : 2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    EN 61193-1 : 2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    EN 61192-3 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 61192-2 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
    ISO 9001:2015 Quality management systems - Requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    ISO 9000:2015 Quality management systems Fundamentals and vocabulary
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    EN 61190-1-2:2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    EN 60194:2006 PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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