NEN EN 123400 : 1995 AMD 2 1995
Current
The latest, up-to-date edition.
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION - FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
12-01-2013
Foreword
Preface
Section 1 - Introduction
1.1 Scope and object
1.2 Related documents
Section 2 - General
Section 3 - Test specimens
3.1 Capability approval
3.2 Quality conformance inspection
Section 4 - Relevant specification
Section 5 - Characteristics of printed boards
Section 6 - Capability test programme
Section 7 - Quality conformance inspection
Section 8 - Test patterns - test boards
8.1 Application of test patterns and test boards
8.2 Composite test pattern (CTP)
8.3 Multiple arrangements of the composite test
patterns
Applies to flexible printed boards without through connections regardless of their mounted method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for quality conformance inspection (lot-by-lot and periodic inspection).
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 123400:1992-11 | Identical |
| BS EN 123400:1992 | Identical |
| EN 123400:1992/A2:1995 | Identical |
| I.S. EN 123400:1994 | Identical |
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