NEN EN 123500 : 1995 AMD 2 1995
Current
The latest, up-to-date edition.
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION - FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
12-01-2013
Foreword
Preface
1. Introduction
1.1 Scope and object
1.2 Related documents
2. General
3. Test specimens
3.1 Capability approval
3.2 Quality conformance inspection
4. Relevant specification
5. Characteristics of printed boards
Table I
Table II
6. Capability test programme
7. Quality conformance inspection
8. Test patterns
8.1 Application of test patterns
8.2 Composite test pattern (CTP)
8.3 Multiple arrangements of the CTP
Figure 2 - Composite test pattern
Figure 3 - Examples of soldered holes
Figure 4 - Examples related to access holes
Figure 5 - Examples of delamination
Applies to flexible printed boards with through connections regardless of their method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection).
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 123500:1992-11 | Identical |
| I.S. EN 123500:1994 | Identical |
| EN 123500:1992/A2:1995 | Identical |
| BS EN 123500:1992 | Identical |
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