NEN EN 130800 : 2001 AMD 1 2003

1 General
   1.1 Scope
   1.2 Related documents
   1.3 Information to be given in a detail
        specification
   1.4 Terminology
   1.5 Marking
2 Preferred ratings and characteristics
   2.1 Preferred climatic categories
   2.2 Preferred values of ratings
3 Quality assessment procedures
   3.1 Primary stage of manufacture
   3.2 Structurally similar components
   3.3 Certified test records
   3.4 Qualification approval
   3.5 Quality conformance inspection
4 Test and measurement procedures
   4.1 Preliminary drying
   4.2 Measuring conditions
   4.3 Mounting
   4.4 Visual examination and check of dimensions
   4.5 Electrical tests
   4.6 Resistance to soldering heat
   4.7 Solderability
   4.8 Shear (adhesion) test
   4.9 Substrate bending test
   4.10 Rapid change of temperature
   4.11 Climatic sequence
   4.12 Damp heat, steady state
   4.13 Characteristics at high and low temperature
   4.14 Surge voltage
   4.15 Endurance
   4.16 Reverse voltage
   4.17 Component solvent resistance
   4.18 Solvent resistance of the marking
Annex A - Test plans for assessment level E
   Table A.1 - Test plan for qualification approval
   Table A.2 - Test plan for quality conformance inspection -
               lot-by-lot tests
   Table A.3 - Test plan for quality conformance inspection -
               periodic tests
Annex B - Test plans for assessment level EZ
   Table B.1 - Test plan for qualification approval - Assessment
               level EZ
   Table B.2 - Test plan for quality conformance inspection -
               lot-by-lot tests
   Table B.3 - Test plan for quality conformance inspection -
               periodic tests
Annex C - Test schedule for assessment levels E and EZ

Applies to tantalum solid electrolyte surface mounting capacitors. These capacitors are primarily intended to be mounted directly onto substrates for hybrid circuits or onto printed boards.