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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
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Published date: 12-01-2013
Publisher: Netherlands Standards
Gives outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
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