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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
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Published date: 12-01-2013
Publisher: Netherlands Standards
Gives standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
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